Hardners for Epoxy Resin

No Product Name Structure CAS No Molecular
Formula
Chemical Name Applicaiton
1 EH-DICY 461-58-5

C2H4N4

Dicyandiamide (DICY) Epoxy resin
2 EH-Melamine 108-78-1

C3H6N6

1,3,5-Triazine-2,4,6-triamine Epoxy resin
3 EH-2MI 693-98-1

C4H6N2

2-Methylimidazole Epoxy resin
4 EH-2PI 670-96-2

C9H8N2

2-Phenylimidazole Epoxy resin
5 EH-12DMI 1739-84-0

C5H8N2

1,2-Dimethylimidazole Epoxy resin
6 EH-24DMI 930-62-1

C5H8N2

2,4-Dimethylimidazole Epoxy resin
7 EH-2E4MI 931-36-2

C6H10N2

2-Ethyl-4-Methyl imidazole Epoxy resin
8 EH-1C2E4MI 23996-25-0

C9H13N3

1-Cyano-2-ethyl-4-methylimidazole Epoxy resin
9 EH-DDS 80-08-0

C12H12O2N2S

4,4’-Diaminodiphenyl Sulfone Epoxy resin
10 EH-4MHHPA 19438-60-9

C9H12O3

4-Methylhexahydrophthalic acid anhydride Epoxy resin
11 EH-THPA 85-43-8

C8H8O3

4-Cyclohexene-1,2-dicarboxylic acid anhydride Epoxy resin
12 EH-MDA 101-77-9

C13H14N2

4,4’-Methylenedianiline Epoxy resin
13 EH-MDAC 1761-71-3

C13H26N2

4,4’-Diaminodicyclohexylmethane Epoxy resin
14 EH-MH-700 19438-60-9; 13149-00-3

C9H12O3; C8H10O3

Hexahydro-4-methylphthalic anhydride (70%); 1,2-Cyclohexanedicarboxylic anhydride (30%) Equivalent to Hitachi Kasei HN-5500 & New Japan Chemical MH-700
15 EH-MTHPA-50 11070-44-3

C9H10O3

Methyl tetrahydrophthalic anhydride Equivalent to Hitachi Kasei HN-2000